——————————————————————————————————————————————
Short course 1 (09:00-12:30)
Atomic Layer Deposition
Annelies Delabie (IMEC), Christoph Detavernier (Ghent University), Erwin Kessels (Eindhoven University of Technology)

Annelies Delabie is staff scientist at IMEC, the Belgian research institute for nanoelectronics and nanotechnology. Her research focuses on the deposition of thin films by means of Atomic Layer Deposition (ALD), mainly high-k dielectric layers for both high performance CMOS and memory applications.

Christophe Detavernier is a professor at the Department of Solid-state Physics at Ghent University in Belgium. His research focuses on coating and contacting of nanostructures. Atomic layer deposition is investigated for its ability for conformal deposition of ultra-thin films onto 3D nanostructures with atomic level control of layer thickness and composition. For contacting applications in nano-electronics, the formation and properties of silicides, germanides and carbides are investigated using in-situ characterization techniques.

Erwin Kessels (W.M.M. Kessels) holds an Associate Professorship in the Department of Applied Physics at the Eindhoven University of Technology (TU/e) in the Netherlands. His work explores the synthesis of nanometer-scale thin films and features using techniques such as (plasma-enhanced) chemical vapor deposition and atomic layer deposition. His research focuses particularly on the development of ultrathin film processes in collaboration with several industrial partners and it incorporates numerous applications such as nanoelectronics, photovoltaics, energy storage, photonics, and flexible electronics. In addition, a large part of the research is devoted to investigations of surface reaction mechanisms with advanced surface-sensitive diagnostics.

Short course content: Atomic Layer Deposition (ALD) is a thin film deposition technique with a number of unique capabilities, such as growth control at the atomic level and conformal deposition over complex nanostructures. In this tutorial, we will introduce ALD and its breakthrough in the 90s as driven by the semiconductor industry. The basic principle of ALD, the use of self-limiting surface reactions, will be explained and illustrated by means of examples of ideal and less ideal ALD processes. The aspects of area-selectivity, low temperature deposition and conformality for ALD and plasma enhanced ALD will be discussed. Finally, novel applications of ALD will be discussed, illustrating the enabling character and growing role of ALD in nanotechnology.
——————————————————————————————————————————————
Short course 2 (09:00-12:30)
MEMS design, processing and packaging
Jan Bienstman, Luc Haspeslagh, Harrie Tilmans (IMEC)

Jan Bienstman (° 1967, Leuven, Belgium) has been active as MEMS designer since 1990. He started at the K.U.Leuven, where he received a PhD. on nonlinear microresonators in 2004. From 2000, he worked for Melexis (automotive) and joined Vivactis (biomedical) in 2005. Since 2007 he is MEMS Design Support Engineer at IMEC.

Luc Haspeslagh received his MSc degree in electrical and mechanical engeneering in 1987 from KULeuven. He is currently Principal Engineer at IMEC, Belgium responsible for developing new process architectures for "More than more" technologies with a strong focus on CMOS-MEMS co-integration.

Harrie Tilmans received the Ph.D. degree in electrical engineering from the University of Twente (The Netherlands) in 1993. He has held several MEMS R&D positions e.g. at Boston University, the University of Wisconsin-Madison, the Catholic University of Leuven, and CP Clare Inc. Since 1999 he is with IMEC (Belgium) where he is responsible for the development of RF-MEMS components and systems. Currently he is the coordinator of the EC-project MEMSPACK.

Short course content: This tutorial deals with all aspects of MEMS: from design over processing till packaging. These 3 aspects cannot be considered seperately: processing and packaging have to be tought of already in the design phase and vice-versa. Besides a general overview, monolithic integration of MEMS and CMOS and RF-MEMS will be discussed in more detail.
——————————————————————————————————————————————
Short course 3 (09:00-12:30)
Fundamentals and applications of e-beam lithography
Hans C. Pfeiffer (HCP Consulting)

Hans C. Pfeiffer retired in 2002 as an IBM fellow after 34 years of service. During his career he pioneered new e-beam technology concepts at IBM and is known for his inventions of Shaped Beams, Character Projection and PREVAIL. He is consulting in the field of e-beam technology.

Short course content: Evolution of e-beam lithography with focus on recent developments in massively parallel pixel projection. Limitations and opportunities of the technology will be discussed together with examples of successful applications and of new prospects and challenges.
——————————————————————————————————————————————
Short course 4 (09:00-12:30)
Nanometrology
P. Eyben, H. Bender, M. Gilbert, W. Vandervorst et al (IMEC)

W. Vandervorst has a Ph.D in electronic engineering, is currently a professor at the KULeuven (dept Physics) and heading the Materials and Components Analysis department at Imec. His research interests are focused on the physics and applications of advanced metrology concepts for next generation technologies. 

P. Eyben has a Ph.D in electronic engineering and is responsible at Imec for the research and application of scanning probes towards the electrical characterization of dopant distributions in (non)-planar devices. His recent interests are in the basic understanding of SSRM and its application to planar CMOS-devices, solar cells, FINFETs and non-Si materials.

M. Gilbert has a Ph.D in Physics (Rouen, France) and is presently working at Imec as a post-doc on the development of the Atomprobe for semiconductor applications.

H. Bender has a Ph.D in Physics and is presently heading the “Structural analysis” group at Imec. He is also teaching at the university (KULeuven) a course on material characterization. His research focus is on the use of Focused Ion Beam and (analytical) Transmission Electron Microscopy for materials analysis and characterization of 2D and 3D-structures.  

Short course content: This short course provides a detailed overview of compositional and electrical characterization of semiconductor structures with an emphasis on very high spatial/depth resolution analysis (targeting sub-nm) and the analysis of three-dimensional structures. Techniques to be covered are electrical scanning probe microscopy (SSRM, C-AFM), 1D/3Dcomposition analysis with SIMS and TEM tomography, strain, EELS, EDX,..) and the 3D-atom imaging with Tomographic Atomprobe/Field ion microscopy. This course will give insight in the basics of these methods as well as into their properties and limitations when applied to nm-scaled devices.

——————————————————————————————————————————————
Short course 5 (13:30-17:00)
Plasma etching for micro-electronics
Eddy Kunnen, Denis Shamiryan (IMEC), Annemie Bogaerts (UA)

Eddy Kunnen received his Master in Physics in 1995 and his Phd in 2000 at the KULeuven. Since 2000 he is working as a dry etch expert at IMEC.

Denis Shamiryan obtained his MSc degree from Novosibirsk State Technical University, Russia in 1996 and PhD degree from Catholic University of Leuven, Belgium in 2004. He currently holds a Senior Scientist position in the Dry Etch group at IMEC, Belgium.

Annemie Bogaerts studied chemistry at the University of Antwerp (Belgium). She received her M.Sc. degree in 2003 and her PhD degree in 1996. Since 2003, she is a professor of physical chemistry at the University of Antwerp, and head of the research group PLASMANT. Her research interests are computer modelling of various kinds of plasmas, plasma-surface interactions for deposition and etching applications and laser-surface interactions.

Short course content: This course explains why plasma etching is a key technique in the fabrication of microelectronics. Continuous downscaling of semiconductor devices to nanometer scale led to the point where conventional materials (Si, SiO2, Al) cannot comply anymore with the device performance requirements. As a result, the conventional materials are being replaced by new ones, new manufacturing approaches and new device architectures are being developed. For example, depending on applications, SiO2 is replaced by dielectrics with higher or lower dielectric constant, Si gates are replaced by metals, Al metallization is replaced by Cu, planar devices are replaced by 3D ones, 3D integration requires contact holes that run through a whole Si wafer. All these changes pose a considerable challenge for plasma etching resulting in a significant increase in the amount of research in this field in the recent years. This course will give insight in the novel plasma etching approaches that enable transfer from micro- to nanoelectronics. The basic principles of how a plasma can be used for anisotropic and selective pattern transfer are taught.
——————————————————————————————————————————————
Short course 6 (13:30-17:00)
Microsystems and smart implants for life sciences, nanobiosensors, nanomedicine
Herc Neves (IMEC), Liesbet Lagae (IMEC), Stefaan De Smedt (UGhent)

Herc Neves earned his Ph.D. in Microelectronics from the University of Edinburgh, Scotland. He is Principal Scientist in biomedical microsystems at IMEC and manager of IMEC’s biomedical program. He has a broad interest in medical implants using microsystem technology and his recent work focuses on microprobe arrays for the in vivo chronic recording of neuron ensembles in the brain. He is also Adjunct Professor of Physics at Uppsala University, Sweden.

Liesbet Lagae studied electrical engineering at the University of Leuven (Belgium). She received her PhD degree in 2003. Since 2006, she is group leader of the Functional Nanosystems Group in the Bionanoelectornics department at IMEC, and since 2008 also an associate professor of nanotechnological biophysics at the University of Leuven.

Stefaan De Smedt is professor in Physical Pharmacy & Biopharmacy at the Department of Pharmaceutics of Ghent where he is chairing the Research Group on Nanomedicines. Recent research interest of Professor De Smedt have included microgels for pulsed drug delivery, extra- and intracellular biophysical barriers to DNA loaded nanoparticles and encoded microparticles for drug screening and diagnostics.  He is associate European editor of the Journal of Controlled Release.

Short course content: As research in nanotechnology extends the tools for fabrication to nanometer dimensions, new bio-analytical and diagnostic tools are being developed that can interact and detect with biology at the cellular and the molecular level.  The short course will provide introductions to three emerging fields of research in biomedical electronics and nanobiotechnology .
- Smart implants: The use of microsystem technology (MEMS) for medical devices offers unique possibilities for the reduced size, autonomy and intelligence of implants. The adoption of such systems should however take into account the peculiarities of the living biological environment. This tutorial will present some of the most promising applications and discuss the main challenges for the adoption of this technology.
- Nanobiosensors: Lab-on-a-chip systems use versatile nanotechnologies to manipulate, transport, sort and detect cells, proteins and DNA molecules, intelligently combined to do full diagnostic analysis.  At the heart of such systems are the affinity based nanobiosensors to detect the analytes.  An overview of state of the art in nanobiosensor technology will be given.
- Improving Drug Delivery by Nanotechnology: This tutorial will explain which major challenges exist for the delivery of new biological drugs. It will demonstrate some new concepts nanomedicines-scientists recently proposed. Examples will be given of failures and successes of micro- and nanomaterials under development for advanced drug delivery purposes. 

——————————————————————————————————————————————
Short course 7 (13:30-17:00)
Nano-imprint lithography and applications
Stella W. Pang (University of Michigan)

Stella W. Pang is a professor in Electrical Engineering and Computer Science at the University of Michigan. Dr. Pang's research interests include nanofabrication technology for microelectromechanical, biomedical, microelectronic, and optical devices. She has over 300 technical papers, book chapters, and invited presentations and is the editor and author of 16 books, journals and conference proceedings. She is a Fellow of IEEE, ECS and AVS.

Short course content: Nanoimprint technology can greatly simplify the production of nanostructures by creating molds that can emboss intricate patterns onto various substrates and materials. In this short course, various nanoimprint technologies and systems will be reviewed including thermal, UV, and reversal nanoimprint. Applications of nanoimprint technology in electronic, photonic, storage, sensor, and biomedical areas will be discussed.

——————————————————————————————————————————————
Short course 8 (13:30-17:00)
Silicon photonics
Wim Bogaerts, Peter Dumon (IMEC - Ghent University, Photonics Research Group)

Wim Bogaerts got his PhD degree in electrical engineering in 2004 at Ghent University, on the fabrication of nanophotonic waveguides in silicon on insulator. He currently coordinates the silicon photonics collaboration between Ghent University and IMEC.

Peter Dumon got his PhD degree in electrical engineering in 2006 at Ghent University, on resonators and filters in silicon photonic wires. He currently coordinates the ePIXfab initiative for multi-project wafer fabrication of silicon photonic circuits in IMEC and CEA-LETI.

Short course content: Principles of silicon waveguides - Coupling light into (and out of) waveguide circuits - Active optical components - Applications - The ePIXfab initative for MPW photonics